New SS ASICs from IMEC
Originally Posted 1998
The IMEC PMCM Digital SS Transceiver Chip
IMEC has developed a range of flexible direct sequence spread
spectrum ASICs, for use in satellite communications and
terrestrial networks. The devices have been developed
in collaboration with SAIT Systems, a Belgium telecom company, and the
European Space Agency.
The family of spread spectrum chips currently available aims at niche
markets where highly reliable wireless communications are required, such
as industrial networks for monitoring and control.
The Programmable Mobile Communications Modem (PMCM) is a digital
transceiver chip integrating baseband and IF functionality with very low
implementation loss. Fully programmable spreader and correlator
functions, band-limiting oversampling filters and IF up-and
down-converters are on chip. The ASIC can process 10 Mchips/s and
incorporates an interface for an external processor for the
application-dependent functionality. The PMCM encapsulates a complexity
equal to 95,000 gates.
The PMCM provides a low cost and highly-miniaturized solution for
applications such as VSAT communications and terminals for Private Mobile
Radio networks via satellite. Code lengths of up to 1024 are supported.
The high processing gain also makes the PMCM a versatile key component
for wireless LAN applications where robustness of the link is crucial,
such as in industrial environments with high and unpredictable
interference levels.
The Advanced Spread spectrum Transceiver ASIC (ASTRA) is a high speed,
low power version of the PMCM, providing 15 Mchips/s, parallel
demodulation of 4 channels and a 32-bit interface to a host processor.
The Direct Sequence Integrated Receiver with ARM (TM) Core (DIRAC)
chip combines flexible and highly integrated IF receiver chain with an
on-chip 32-bit ARM microprocessor core. Cost effective spread spectrum
receivers, for satellite services for example, can be built using this
device.
A spread spectrum development kit built around the PMCM allows users
to explore programmable parameter ranges and to determine the parameter
set tuned towards a particular application.
A rapid design turnaround cycle - in the order of weeks - towards
customized components is possible due to the modular architecture of the
devices and the advanced CATHEDRAL CAD environment developed at IMEC.
Specification, synthesis and simulation at different abstraction levels
are all provided in an integrated toolbox. A link with the Synopsys,
Inc.'s (Mountain View, CA) design tools ensures compliance with
industrial standards of ASIC design. The design path is open to any
foundry.
A current development is the integration of digital, and analog modem
components in an MCM (Multi-Chip Module) package, which enables further
reductions in size and cost.
The next generation of ASICs will concentrate on high-speed operation
for markets such as wireless LAN, wireless multimedia and wireless office
products.
Editor's Note: IMEC was founded in 1984 and is headquartered in Leuven, Belgium. It is Europe's
leading independent research center for the development and licensing
of microelectronics, and information and communication technologies (ICT). IMEC
employs over 1000 people. Its 36,000 sq. ft. clean room is dedicated to
advanced research and development into semiconductor processing
technologies. IMEC's annual budget is more than 4.4 billion BF (103 million Euro).
Its revenue is derived from agreements and contracts with government agencies, aerospace
and semiconductor industry companies world-wide.
IMEC's activities concentrate on design of integrated information and communication systems;
silicon process technology; silicon technology and device integration; microsystems,
components and packaging; and advanced training in microelectronics.
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